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LPM-1 laser micro cluster perforation, material treatment, mass products
laser micro perforation productLPM-1 high-speed laser micro perforatorLPM-1 high-speed laser micro perforatorlaser micro perforation product

LPM-1 laser micro cluster perforation, material treatment, mass products

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Description

LPM-1 is patent granted by DE102004001327, operates with quadruple Co2 carbon or other laser beam inputs up to 4 Kilowatt to a high power twin vacuum level multiplexer to generate up to 200 individual laser output channels and perforation rows cross web, combines automatic positioned laser perforation heads, focus setting, web speeds up to 400 m/min, web widths up to 2000 mm, up to 2.5 Million holes per second, jumbo roll-by-roll production, optical inline permeability as perforation line position control, porosity feedback, hi-tech automation level and other features. Each laser micro perforation lines can achieve 100 up to 1000 C.U.

Industry fields
The conception of high power twin level laser beam multiplexer enables hundred options in other industry application fields as cutting, cut-off, welding, surface finishing, high speed drilling, ablation, cleaning, micromachining, polishing, forming, melting, surface treatment, roughness improvement. Each up to 200 single laser beams is coupled via flexible hollow fibers allows treatment processes or micro perforation heads easy to position in X across and in Y direction of running web or static placed sheet material. The automatic processes, equipments and devices open now outstanding possibilities in industry, metal, plastic, domestic, tobacco product, medical, hygienic, wall covering, security cards, bank notes or food application. LPM-1 means cluster material treatment at wide web, large area, surface or whole material treatment, high power dual rotation laser beam splitter, twin multiplexer level, Co2, YAG, EXCIMER, DIODE, SOLID STATE laser with multiple optical inputs, flexible hollow waveguide fibers, HCW, HWG up to 200 output channels. Material treatment with robot handling for stainless steel, ceramic, aluminum, wafer, glass, ceramic, brass, copper, wafer, silicon, plastic sheets, titanium, jewelry, silicon, solar, panel, photovoltaic, micromachining, slitting, rewinding, refining, hybrid laser cutting machines or stand along systems.

Micro laser perforation technology
Laser perforation in general, possible to perforate by pulsed or enlarged focused laser beams are holes sizes from 60 up to 200 microns at density of holes of typically 10-30 holes per cm, holes sequences 100000 up to 400000 holes per second at a maximal of 16 punctured laser rows cross web with traditional systems or machines.

Means in cigarette, tipping, plug wrap, filter, flexible packaging, packs, tear tape, plastic and other material webs. With porosity levels from 100 up to 3000 C. U., normally in web widths from 100 up to 500 mm, in particular cases up to 1500 mm, at web speeds of up to 600 m/min, depending on porosity and material consistency in relation to its ability to perforate.