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Description

This novel invention uses polishing techniques to slowly polish or abrade away stepped layers of an object to be scanned. The scanned object is cast into a contrasting resin which provides a dark (or light) background for photography. The layers are digitally photographed stepwise to produce a record of internal structures. 2D digital images are reassembled using computer and software methods to produce exquisitely fine detailed 3D digital models of the solid internal structures in full color.

Because polishing can be controlled tightly, layers may be removed in the in the nanometer realm. This implies the limiting barrier in resolution is the pixel size of the recording camera. These cameras pixels are getting denser and denser as technology progresses which only improves the performance of the 3D scanner.

The multi-spectral light used to illuminate the image plane can be used to identify the chemical components of the object. Therefore the 3D scanner has a spectrometer function as well.

The Full Color 3D Solid Image Scanner would be important in the semiconductor industry. Most importantly 1st article scanning semiconductor devices to determine as manufactured state vs. as designed.

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